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Nintendo 3DS Architecture

Chapter 8: I/O


Table of Contents

  1. External interfaces and peripherals
    1. The 'New' enhancements
  2. Internal interfaces
    1. The supplemental computer
  3. Ready for trends

This section tends to be very rich in technologies considering Nintendo's consoles favour generous I/O before state-of-the-art CPUs and GPUs. Let's see what the Nintendo 3DS offers.

External interfaces and peripherals

The Nintendo DS had tons of modules built-in and the Nintendo DSi added more on top of it (after removing the GBA Slot). Now we find ourselves with a new console combining interfaces from two decades (the 2000s and 2010s).

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Main diagram of the console's architecture. You can sense that the I/O area on the left side was a strong selling point of this console.

To be fair, we still don't have a standard like USB, but that may be expendable considering the Nintendo 3DS bundles the following:

The 'New' enhancements

If that wasn't enough, the New 3DS came with more modules on top. This includes:

Now, to prevent leaving 'old' users behind, Nintendo provided external accessories to enhance the old models, although most of them relied on the single infrared transceiver to connect. Thus, only one accessory could be connected at the same time.

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Front view of the New Nintendo 3DS XL and the original 3DS, notice the different button sets each one offers.

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The original 3DS with the SD slot opened. Here you can see the two back cameras, the SD slot and an audio jack port. With the New 3DS, the microSD can't be replaced without taking the back cover off.

Not all the exclusive features of the New 3DS can be replicated, however. For instance, the New 3DS' head tracking mechanism depends on the extra ARM11 core.

Internal interfaces

Now it's time to check how are these interfaces - and others - internally wired up.

Firstly, a large subset is interconnected with the standard Serial Peripheral Interface (SPI) protocol. There are four SPI buses and all of them are accessed by the ARM9 (which I assume also includes the ARM7). The ARM11 only has access to most of them . In any case, the SPI buses connect the following modules :

Curiously enough, some peripherals are interfaced twice to replicate the old DS/DSi's I/O layout and also provide extended capabilities for 3DS software.

Secondly, there's a Human-interface device (HID) module connected to both ARM11 and ARM9 data buses. This is how the digital keypad is accessed. The data is read through a 16-bit register.

Moving on, we got an I²C block which uses a more sophisticated serial protocol. This is connected to the following :

Finally, there are various registers interfacing FIFO blocks which, in turn, connect to two relatively high-speed (16 MB/s) peripherals :

The supplemental computer

As confusing as it may sound, there's more hardware left to discuss. The rest is handled by a middle-man chip called Auxiliary Microcontroller (MCU) . This is just a microcontroller designed by NEC and manufactured by Renesas. Particularly, the model 78K0R, which bundles a proprietary (yet low-power and relatively modern) processor and a ROM . The 78K0R stores a firmware handled by the console's operating system, both ARM9 and ARM11 can interact with it but so do other peripherals.

The MCU chip exclusively controls the following :

A subset of this group is already accessible by the main CPUs. This is because the MCU also perform monitoring tasks, thereby saving resources from the ARM11 or ARM9.

With such a heavy list of I/O hardware, you can now see how Nintendo tried to compete against the smartphone market. This led to interesting services deployed throughout the console's lifecycle:


Previous: 7. Audio

Next: 9. Operating System


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